dt-bindings: thermal: Add AOP regulator cooling device bindings
Add bindings for AOP regulator cooling device driver. This driver will be used to place voltage floor restriction for RPMh controlled rail. Change-Id: I80367fdc3f073f768c0115c882e88ed57b657cef Signed-off-by: Ram Chandrasekar <rkumbako@codeaurora.org>
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RPMh regulator cooling device.
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The RPMh regulator cooling device, will be used to place a voltage floor
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restriction on a rail. This cooling device will use a QMP AOP mail box to send
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the message to apply and clear voltage floor restriction.
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The cooling device node should be a child of the regulator devicetree node,
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which it is trying to place the floor restriction.
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Properties:
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- compatible:
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Usage: required
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Value type: <string>
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Definition: shall be "qcom,rpmh-reg-cdev"
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- qcom,reg-resource-name:
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Usage: required
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Value type: <string>
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Definition: The regulator resource name to be used for communicating
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with RPMh. This value should be any of the below
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resource name,
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cx -> For CX rail,
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mx -> For MX rail,
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ebi -> For EBI rail.
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- mboxes:
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Usage: required
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Value type: <phandle>
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Definition: A phandle to the QMP AOP mail box, that needs to be used
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for sending the floor restriction message.
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- #cooling-cells: Must be 2. Please refer to
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<devicetree/bindings/thermal/thermal.txt> for more
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details.
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Example:
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vdd_cx: rpmh-cx-regulator-cdev {
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compatible = "qcom,rpmh-reg-cdev";
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mboxes = <&qmp_aop 0>;
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qcom,reg-resource-name = "cx";
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#cooling-cells = <2>;
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};
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