dt-bindings: thermal: Add AOP regulator cooling device bindings

Add bindings for AOP regulator cooling device driver. This driver will
be used to place voltage floor restriction for RPMh controlled rail.

Change-Id: I80367fdc3f073f768c0115c882e88ed57b657cef
Signed-off-by: Ram Chandrasekar <rkumbako@codeaurora.org>
This commit is contained in:
Ram Chandrasekar 2018-10-08 14:08:32 -06:00 committed by Manaf Meethalavalappu Pallikunhi
parent dd35a49383
commit 0ee0220d8b

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RPMh regulator cooling device.
The RPMh regulator cooling device, will be used to place a voltage floor
restriction on a rail. This cooling device will use a QMP AOP mail box to send
the message to apply and clear voltage floor restriction.
The cooling device node should be a child of the regulator devicetree node,
which it is trying to place the floor restriction.
Properties:
- compatible:
Usage: required
Value type: <string>
Definition: shall be "qcom,rpmh-reg-cdev"
- qcom,reg-resource-name:
Usage: required
Value type: <string>
Definition: The regulator resource name to be used for communicating
with RPMh. This value should be any of the below
resource name,
cx -> For CX rail,
mx -> For MX rail,
ebi -> For EBI rail.
- mboxes:
Usage: required
Value type: <phandle>
Definition: A phandle to the QMP AOP mail box, that needs to be used
for sending the floor restriction message.
- #cooling-cells: Must be 2. Please refer to
<devicetree/bindings/thermal/thermal.txt> for more
details.
Example:
vdd_cx: rpmh-cx-regulator-cdev {
compatible = "qcom,rpmh-reg-cdev";
mboxes = <&qmp_aop 0>;
qcom,reg-resource-name = "cx";
#cooling-cells = <2>;
};